新材料科(ke)技與化學技術(shu)創新
電鍍中間(jian)體/水性工業塗(tu)料/工業清洗化(hua)學品
BondFilm MS 800流程圖(tú) – 水平線
|
|
|
|
|
| Cu-surface-after-BondFilm-treatment-x-5000 | Reliable-sequential-build-up-with-BondFilm | Reliable-and-desired-brown-organo-metallic-surface-finish | Uniform-roughening-for-improved-adhesion |
下一頁
