Circuposit™ 3000-1 from Dupont Dow Rhom Hass Company

Circuposit™ 3000-1 Electroless Copper is a unique, patented process that is widely used by leading PCB fabricators throughout the world. This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space and improving quality and control. The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.
 

Key Properties

• Exceptional Interconnect Reliability
• Horizontal or vertical application
• Excellent bath stability and performance
• Reduced bath maintenance
• Reduction in solution volume growth
• Low-build or high-build deposition
   

酸性鍍銅中(zhōng)間體相關鏈接：

垂(chui)直連續電鍍（VCP）高TP值(zhi)酸性鍍銅光澤劑(jì)用電鍍中間體✌️： benxiaohai.cc/news/170.html
 

PCB/FPC用(yong)高TP值VCP酸性鍍銅光(guāng)亮劑中間體産品(pin)介紹： benxiaohai.cc/news/30.html
 

2021年度填孔鍍(dù)銅——印刷線路闆（PCB，FPC）酸(suān)性填孔鍍銅中間(jian)體： benxiaohai.cc/news/283.html

 

2021年國際表面處(chu)理展電子展廳：

深(shen)圳市同泰化學技(jì)術有限公司參加(jia)了2021年7月26-28日在廣州(zhou)保利世貿博覽館(guan)舉辦的第十四屆(jie)廣州國際表面處(chu)理、電鍍、塗裝展覽(lǎn)會，誠邀您莅臨同(tóng)泰化學電子展廳(tīng)參觀🍓指導！電子展(zhan)廳鏈接：benxiaohai.cc/news/316.html 。