BondFilm® MS 800通過更(gèng)低的咬蝕量(liàng),提供可靠的(de)結合力 & 熱可(kě)靠性; 成本更(gèng)低。
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| Cu-surface-after-BondFilm-treatment-x-5000 | Reliable-sequential-build-up-with-BondFilm | Reliable-and-desired-brown-organo-metallic-surface-finish | Uniform-roughening-for-improved-adhesion |
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